t gp2 61 5 15 - to 1 9 - ghz 6 - bit digital phase shifter preliminary datasheet: rev - 07 - 11 - 14 - 1 of 9 - disclaimer: subject to change without notice ? 2014 triquint www.triquint.com applications ? phased - array radar ? satellite communications general description triquints tgp261 5 is a 6 - bit digital phase shifter fabricated on triquints high - performance 0.15 - m gaas phemt pr ocess. it operates over 15 to 19 ghz , and provides 360 of phase coverage with a lsb of 5.625. it also achieves a low rms phase error of 4 , with 7 - db average in sertion loss over all states. the tg p261 5 uses positive single - control - line switch logic, eliminati ng the need fo r a negative voltage rail or complimentary logic . this, combined with low insertion loss and a high degre e of resolution makes the tgp261 5 ideally suited for applications in phased - array radar and satellite communications . the device is lead - free and rohs compliant. ordering information part eccn description tg p 2615 ear99 6 - bit digital phase s hifter (+v c ) product features ? 6 - bit digital phase shifter ? frequency range: 15 to 1 9 ghz ? 360 coverage, lsb = 5.625 ? rms phase error : 4 ? rms amplitude error: 1 db ? insertion loss: 7 db ? input return loss: > 10 db ? output return loss: >9 db ? input ip3: >34 dbm ? input p1db: >24 dbm ? positive control logic : 0/+3.3 v ? c hip dimensions: 2.11 x 1.47 x 0.1 0 mm p ad configuration p ad no. symbol 1 rf i n 2 5 3 11 4 180 5 45 6 90 7 22 8 v ref 9 rf out 10 180 11 11 12 5 functional block diagram ref +22 ref +45 ref +90 ref +180 ref +11 ref +5 8 7 6 5 4 3 2 10 11 12 1 9
t gp2 61 5 15 - to 1 9 - ghz 6 - bit digital phase shifter preliminary datasheet: rev - 07 - 11 - 14 - 2 of 9 - disclaimer: subject to change without notice ? 2014 triquint www.triquint.com absolute maximum ratings parameter value control and reference voltage 6 v power dissipation 0.8 w input power , cw, 50 , 85c 30 dbm channel t emperature 200c mounting temperature (30 seconds) 320c storage temperature ? 55 to 150 c operation of this device outside the parameter ranges given above may cause permanent damage. these are stress ratings only, and functional operation of the device at these conditions is not implied. recommended operating conditions parameter value control vo l tage (5 , 11 , 22 , 45 , 90 , 180 ) 0/+3.3 v reference voltage ( v ref ) +3.3 v electrical specifications are measured at specified test conditions. specifications are not guaranteed over all recommended operating conditions. electrical specifications test conditions unless otherwise noted: 25c. control voltage (ref, 5 , 11 , 22 , 45 , 90 , 180 ) = 0/+3.3 v; see bias truth table. parameter conditions min typ max units operational frequency range 15 1 9 ghz insertion loss average across all phase states 6 - 8 db input return loss average across all phase states > 10 db output return loss average across all phase states > 9 db rms phase error 4 deg rms amplitude error 1 db input p1db >2 4 dbm input ip3 tone spacing = 10 mhz pin/tone = 15 dbm > 34 dbm insertion loss temperature coefficient average all phase states , 19 ghz 0.00 2 db/ c control current +/ - 20 ua bias truth table l ogic 0 = 0 v, logic 1 = v ref = + 3.3 v phase shifter 5 11 22 45 90 180 ref 0 (reference) 0 0 0 0 0 0 1 5 1 0 0 0 0 0 1 11 0 1 0 0 0 0 1 22 0 0 1 0 0 0 1 45 0 0 0 1 0 0 1 90 0 0 0 0 1 0 1 180 0 0 0 0 0 1 1 355 1 1 1 1 1 1 1
t gp2 61 5 15 - to 1 9 - ghz 6 - bit digital phase shifter preliminary datasheet: rev - 07 - 11 - 14 - 3 of 9 - disclaimer: subject to change without notice ? 2014 triquint www.triquint.com thermal and reliability information parameter test conditions value units channel temperature (t ch ) t baseplate = 85 c 8 5 c median lifetime (t m ) 5.2 e+9 hrs notes: 1. under normal (lifetime) operating conditions, self - heating is not a significant contributor to channel temperature. median lifetime 1e+03 1e+04 1e+05 1e+06 1e+07 1e+08 1e+09 1e+10 1e+11 1e+12 1e+13 1e+14 1e+15 25 50 75 100 125 150 175 200 median lifetime, t m (hours) channel temperature, t ch ( c) median lifetime vs. channel temperature fet5
t gp2 61 5 15 - to 1 9 - ghz 6 - bit digital phase shifter preliminary datasheet: rev - 07 - 11 - 14 - 4 of 9 - disclaimer: subject to change without notice ? 2014 triquint www.triquint.com typical performance -10 -8 -6 -4 -2 0 15 16 17 18 19 s21 (db) frequency (ghz) peak insertion loss vs frequency all phase states, 25 o c, v ref = 3.3 v min avg max 0 1 2 3 4 5 15 16 17 18 19 rms phase error (degrees) frequency (ghz) rms phase error vs frequency all phase states, v ref = 3.3 v -50 c +25 c +85 c 0.0 0.5 1.0 1.5 2.0 2.5 15 16 17 18 19 rms amplitude error (db) frequency (ghz) rms amplitude error vs frequency all phase states, v ref = 3.3 v -50 c +25 c +85 c -10 -8 -6 -4 -2 0 15 16 17 18 19 s21 (db) frequency (ghz) average insertion loss vs temperature all phase states, v ref = 3.3 v -50 c +25 c +85 c -25 -20 -15 -10 -5 0 15 16 17 18 19 s11 (db) frequency (ghz) input return loss vs frequency all phase states, 25 o c, v ref = 3.3 v peak avg -25 -20 -15 -10 -5 0 15 16 17 18 19 peak s11 (db) frequency (ghz) input return loss vs temperature all phase states, v ref = 3.3 v -50 c +25 c +85 c
t gp2 61 5 15 - to 1 9 - ghz 6 - bit digital phase shifter preliminary datasheet: rev - 07 - 11 - 14 - 5 of 9 - disclaimer: subject to change without notice ? 2014 triquint www.triquint.com typical performance -0.25 -0.20 -0.15 -0.10 -0.05 0.00 15 16 17 18 19 s21 temp coefficient (db / 100 o c) frequency (ghz) loss temperature coefficient vs frequency all phase states, - 50 to +85 o c, v ref = 3.3 v -25 -20 -15 -10 -5 0 15 16 17 18 19 peak s22 (db) frequency (ghz) output return loss vs temperature all phase states, v ref = 3.3 v -50 c +25 c +85 c -25 -20 -15 -10 -5 0 15 16 17 18 19 s22 (db) frequency (ghz) output return loss vs frequency all phase states, 25 o c, v ref = 3.3 v peak avg 28 31 34 37 40 43 15 16 17 18 19 third - order intercept (dbm) frequency (ghz) input toi vs frequency major phase states, 25 o c, v ref = 3.3 v 0 deg 5 deg 11 deg 22 deg 45 deg 90 deg 180 deg 355 deg 28 31 34 37 40 43 15 16 17 18 19 third - order intercept (dbm) frequency (ghz) input toi vs frequency major phase states, 85 o c, v ref = 3.3 v 0 deg 5 deg 11 deg 22 deg 45 deg 90 deg 180 deg 355 deg 20 22 24 26 28 30 15 16 17 18 19 input p1db (dbm) frequency (ghz) input p1db vs frequency major phase states, 25 o c, v ref = 3.3 v 0 deg 5 deg 11 deg 22 deg 45 deg 90 deg 180 deg 355 deg test limit 28 dbm
t gp2 61 5 15 - to 1 9 - ghz 6 - bit digital phase shifter preliminary datasheet: rev - 07 - 11 - 14 - 6 of 9 - disclaimer: subject to change without notice ? 2014 triquint www.triquint.com mechanical information and bond pad description bond pad symbol description pad size 1 rf in rf input; 50 ; dc - blocked 0.100 x 0.2 00 2 5 5 bit control 0.100 x 0.100 3 11 11 bit control 0.100 x 0.100 4 180 180 bit control 0.100 x 0.100 5 45 45 bit control 0.100 x 0.100 6 90 90 bit control 0.100 x 0.100 7 22 22 bit control 0.100 x 0.100 8 v ref reference voltage for logic 1 0.100 x 0.100 9 rf out rf output; 50 ; dc - blocked 0.100 x 0.2 00 10 180 180 bit alternate control 0.100 x 0.100 11 11 11 bit alternate control 0.100 x 0.100 12 5 5 bit alternate control 0.100 x 0.100 unit: millimeters thickness: 0.10 die x, y size tolerance: 0.050 chip edge to bond pad dimensions are shown to center of pad ground is backside of die
t gp2 61 5 15 - to 1 9 - ghz 6 - bit digital phase shifter preliminary datasheet: rev - 07 - 11 - 14 - 7 of 9 - disclaimer: subject to change without notice ? 2014 triquint www.triquint.com assembly drawing - t he spacing between mmic and tfn (at rf in or rf out) is < 5 mils typical. - rf connections: bond two 1 mil diameter, < 20 mils length , gold bond wires at rf in and rf out for optimum rf performance. - for fixtured testing, device was rotated 180 degrees from orientation in the page - 1 chip photograph. 5 o 180 o 90 o 11 o 45 o 22 o v re f rf in rf out
t gp2 61 5 15 - to 1 9 - ghz 6 - bit digital phase shifter preliminary datasheet: rev - 07 - 11 - 14 - 8 of 9 - disclaimer: subject to change without notice ? 2014 triquint www.triquint.com assembly notes component placement and adhesive attachment assembly notes: ? vacuum pencils and/or vacuum collets are the preferred method of pick up. ? contact with a ir bridges must be avoided during placement. ? the force impact is critical during auto placement. ? solder or organic adhesive attachment may be used for this part . ? devices must be stored in a dry nitrogen atmosphere. solder attachment reflow process assembly notes: ? use ausn (80/20) solder and limit exposure to temperatures above 300 c to 3 to 4 minutes, maximum. ? an alloy station or conveyor furnace with reducing atmosphere should be used. ? do not use any kind of flux. ? coefficient of thermal expansion m atching is critical for long - term reliability. organic adhesive attachment assembly notes: ? the organics such as epoxy or polyimide can be used. ? epoxies cure at temperatures of 100 to 200 c. ? curing should be done in a convection oven; proper exhaust is a s afety concern. interconnect process assembly notes: ? thermosonic ball bonding is the preferred interconnect technique. ? force, time, and ultrasonics are critical parameters. ? aluminum wire should not be used. ? devices with small pad sizes should be bonded with 0.0007 - inch wire.
t gp2 61 5 15 - to 1 9 - ghz 6 - bit digital phase shifter preliminary datasheet: rev - 07 - 11 - 14 - 9 of 9 - disclaimer: subject to change without notice ? 2014 triquint www.triquint.com product compliance information esd sensitivity ratings caution! esd - sensitive device esd rating: tbd value: tbd test: human body model (hbm) standard: jedec standard jesd22 - a114 solderability this part is compliant with eu 2002/95/ec rohs directive (restrictions on the use of certain hazardous substances in electrical and electronic equipment). this product also has the following attributes: ? lead free ? halogen free (chlorine, bromine) ? antimony free ? tbbp - a (c 15 h 12 br 4 0 2 ) free ? pfos free ? svhc free eccn us department of commerce: ear99 contact information for the latest specifications, additional product information, worldwide sales and distribution locations, and information about triquint: web: www.triquint.com tel: +1. 972 . 994 . 8465 email: info - sales@triquint.com fax: +1. 972 . 994 . 8504 for technical questions and application information: email: info - products@triquint.com important notice the information contained herein is believed to be reliable. triquint makes no warranties regarding the information contained herein. triquint assumes no responsibility or liability whatsoever for any of the information contained herein. triquint assume s no responsibility or liability whatsoever for the use of the information contained herein. the information contained herein is provided "as is, where is" and with all faults, and the entire risk associated with such information is entirely with the user . all information contained herein is subject to change without notice. customers should obtain and verify the latest relevant information before placing orders for triquint products. the information contained herein or any use of such information does not grant, explicitly or implicitly, to any party any patent rights, licenses, or any other intellectual property rights, whether with regard to such information itself or anything described by such information. triquint products are not warranted or aut horized for use as critical components in medical, life - saving, or life - sustaining applications, or other applications where a failure would reasonably be expected to cause severe personal injury or death.
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